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Diffusion bonding of Al alloy to Al2O3 ceramicFENG Ji-cai(冯吉才), WANG Da-yong(王大勇), LI Zhuo-ran(李卓然), LIU Hui-jie(刘会杰)(National Key Laboratory of Advanced Welding Production Technology,Harbin Institute of Technology, Harbin 150001, China)Abstract:A layer of Cu was sintered on the surface of Al2O3 ceramic before bonding, and then diffusion bonding technology was applied to bond Al2O3/Cu to Al......
SUPERPLASTICITY AND DIFFUSION BONDING OF IN718 SUPERALLOY K.F. Zhang1,D.Z. Wu1,W.B. Han1,B. Wang1 (1.School of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001, China) Abstract:The superplasticity and diffusion bonding of IN718 superalloy were studied in this article. The strain rate sensitivity index m was obtained at different temperatures and various initial......
Atomic diffusion properties in wire bonding LI Jun-hui(李军辉), WANG Fu-liang(王福亮), HAN Lei(韩 雷), DUAN Ji-an(段吉安), ZHONG Jue(钟 掘) College of Mechanical-Electronical Engineering, Central South... interface but in basis material, and the bonded strength at interface is enhanced by diffused atom from the other side. Key words: thermosonic bond; atomic diffusion; dimples, bonding strength  ......
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Influences of diffusion bonding process parameters on bond characteristics of Mg-Cu dissimilar joints G. MAHENDRAN1, V. BALASUBRAMANIAN2, T. SENTHILVELAN3 1. Department of Mechanical... in the microstructure and joint performance of Mg-Cu joints. However, diffusion bonding can be used to join these alloys without much difficulty. This work analyses the effect of parameters on diffusion layer......
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Diffusion bonding of g-TiAl alloy to Ti-6Al-4V alloy under hot pressure WANG Xiu-feng(王秀锋)1, MA Mo(马 蓦)1, LIU Xue-bin(刘学斌)1, WU Xue-qing(吴学庆)1, TAN Chao-gui(檀朝桂)1, SHI Rong-kai(石荣凯)1, LIN Jiang... of Education, Xiangtan University, Xiangtan 411105, China Received 8 December 2005; accepted 20 April 2006 Abstract: The diffusion bonding of g-TiAl alloy to Ti-6Al-4V alloy at different......
condition, and is unfavorable to the diffusion between the Au and Ag metal, which leads to lower strength or unsuccessful bonding. The bonding process between Au and Ag is an atom combination process, which... bonding or low bonding strength. 2) Appropriate temperature can soften the metal material, and accelerate the diffusion between the Au and Ag atom, which results in good bonding. According to atom......
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HIP diffusion bonding of P/M titanium alloy Ti-6Al-4V and stainless steel 1Cr18Ni9Ti LANG Ze-bao(郎泽保), WANG Liang(王亮), ZHANG Xu-hu(张绪虎) Aerospace Research Institute of Materials and Processing...: The HIP diffusion bonding of P/M titanium alloy Ti-6Al-4V and stainless steel 1Cr18Ni9Ti using pure Ni as intermediate layer was studied. Bonding joint with complex bonding interface was obtained......